The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately. The tool also allows for modification of dimensional attributes of IPC approved land patterns. One of these seems to be a greatly increased sensitivity of the Autosnap markers - in the past, I had to be near an endpoint, for example, for the command to snap to the point. With Depence it is now possible to simply snap fixtures onto other fixtures. I only just had my version updated to 2009 this week and beyond the major layout change I've noticed some other things that were either cool or outright annoying. This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. To rotate your camera around your focused point hold ALT and your left. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density. Revision B includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. IPC J-STD-006C+AMD1-2017 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications + Amendment 1 The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards. This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004, Requirements for Soldering Fluxes IPC/EIA J-STD-005, Requirements for Soldering Pastes IPC J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.
The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards.
0 kommentar(er)
